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610mmx710mm LDI Equipment 30um 24um Laser direct imaging

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Jiangsu GIS Laser Technologies Inc.,

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610mmx710mm LDI Equipment 30um 24um Laser direct imaging

Brand Name : GIS

Model Number : DPX230

Certification : ISO 9001 CE

Place of Origin : Jiangsu, China

MOQ : 1 set

Price : negotiable price

Supply Ability : 30set per month

Delivery Time : 20 work days

Packaging Details : wooden case packing

Name : laser Direct Imaging (LDI)

Application : PCB HDI FPC

Exposure Size Max : 610*710mm

Line Width : 30μ

Line Line Distance : 10%

Line Width tolerance : 10%

Alignment Capability : 24μm

Laser Type : LD Laser, 405±5nm

Efficient : 30-40S@18"*24"

Deviation increase and decrease : Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment

File Format : Gerber 274X, ODB++

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laser direct imaging (LDI) system solutions for various PCB

When a circuit board is made, the imaging process is what defines the circuit traces. While the traditional imaging process requires a photo-tool and UV-light to transfer images, LDI only uses a computer-controlled, highly focused, laser beam to directly define the circuit pattern onto the board.

PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.

How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model	DPX230
Application	PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production)	30um
Capacity	30-40S@18"*24"
Exposure Size	610*710mm
Panel thickness	0.05mm-3.5mm
Alignment Mode	UV-Mark
Alignment capability	Outer layer±12um；Inner laye±24um
Line width tolerance	±10%
Deviation increase and decrease mode	Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type	LD Laser,405±5nm
File format	Gerber 274X；ODB++
Power	380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition	Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment

About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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610mmx710mm LDI Equipment 30um 24um Laser direct imaging Images

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610mmx710mm LDI Equipment 30um 24um Laser direct imaging

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610mmx710mm LDI Equipment 30um 24um Laser direct imaging Images