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Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
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260mmx810mm LDI System Roll To Roll PCB HDI FPC 380V Three Phase

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260mmx810mm LDI System Roll To Roll PCB HDI FPC 380V Three Phase

Brand Name : GIS

Model Number : RTR315

Certification : ISO 9001 CE

Place of Origin : Jiangsu, China

MOQ : 1 set

Price : negotiable price

Supply Ability : 30set per month

Delivery Time : 20 work days

Packaging Details : wooden case packing

Name : laser Direct Imaging (LDI)

Application : PCB HDI FPC

Exposure Size Max : 260*810mm

Line Width : 15μ

Line Line Distance : 10%

Line Width tolerance : 10%

Alignment Capability : 12/24μm

Laser Type : LD Laser, 405±5nm

Efficient : 12S@18"*24"

Deviation increase and decrease : Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment

File Format : Gerber 274X, ODB++

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laser direct imaging (LDI) system solutions LDI Roll to Roll PCB


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model RTR315
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 15um
Capacity 12S@18"*24"
Exposure Size 260*800mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment

Advantages of LDI over Photo Processing

Traditional photo processes requires multiple steps to create the phototool used to generate the image on the PCB. This has generated a number or challenges for PCB fabricators over the years. LDI provides a number of advantages:

· Quality – photo film issues in the past have resulted in imperfect images due to inherent susceptibility to fluctuations in temperature or humidity. Laser images result in much more precise and consistent images, and eliminate any film-related defects.

· Laser imaging provides precise positioning and improved resolution. Image lines, spaces, and alignment are more accurate.

· Photo methodology requires temperature and humidity controlled environments to provide the most accurate transfer of images to boards. LDI reduces the impact of environment on the resulting images, and removes the impact of light refraction inherent with photo processing techniques.

LDI fabrication offers specific advantages where short runs or quick turn-around are required, making creation of artwork and setup of phototool methods impractical. LDI is also an important factor when close tolerances and tight registration are involved.

Today’s customer demands for smaller, lighter, high-density PCBs are quickly edging out photo technology as a practical tool in generating PCB images.


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.


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